Can be used for PCBs repairing and for PCBs production on solder machine with double or single wave. Designed for application in spreading systems using foam or spraying. Suitable for lead free solder or for solder with lead content. Ensure solder connections with good mechanical and electrical parameters. Create small quantity of vapours during soldering. “NO CLEAN” flux enable to abandon the washing phase. Characterised by low content of solids and absence of halides.
- Colour : transparent
- Density at 25°C : 0,802 g/cm3
- Flash-point : 20°C
- Halides content : n/a
- Solids content : 2,2%
- Washability : no need
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